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Mechanical stress is a key failure mechanism to consider when designing electronics systems. Excessive mechanical stress can cause cracking, rupture, fatigue, delamination, or even excessive deflection (such as in optical assemblies). Since most electronics systems are not also designed to be a part of the main mechanical load bearing structure, thermal expansion is a primary source of mechanical stress. Belajar membaca untuk anak tk. CTE (coefficient of thermal expansion) mismatch typically comes to mind when discussing thermal stress, but high-temperature gradients also can cause differential expansion and excessive stress even when the materials are carefully chosen for the best CTE match.